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Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives
  • Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives
  • Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives
  • Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives
  • Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives
  • Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives

HOAOH

Thermal Tape, 25m x 20mm x 0.2mm Double Side Thermal Adhesive Tapes Cooling Pad Apply to Heatsink, LED, IGBT, IC Chip, Computer CPU,GPU, Modules, MOS Tube, SSD Drives

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Material
Aluminum, Silicone
Number of Items
1
Special Feature
Strong
Size
25m x 20mm x 0.20mm

Key features

  • ❀ Thermal Adhesive Tape is a simple and practical tape, easy to install, easy to use, easy to eliminate.
  • ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression.
  • ❀ EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 3.0 W/mK.
  • ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ✔Widely used in most electronic devices,High tensile strength and strong adhesion hold the device firmly in place, to achieve the most effective thermal dissipation
  • ❀ Used for fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,heat sink and IC chip bonding, high power LED and heat aluminum bonding.

Specifications

BrandHOAOH
MaterialAluminum, Silicone
Number of Items1
Special FeatureStrong
Size25m x 20mm x 0.20mm
Compatible MaterialAluminum, Metal
Package Dimensions4.5 x 4.3 x 0.8 inches
Item Weight5.6 ounces
ManufacturerHOAOH
Item model numberHOAOH Thermal Adhesive Tape
ASINB08KLC2FSZ

About this product

HOAOH thermal adhesive Pad With Thermal conductivity, strong stickiness, softness, Insulation, Non-conductive, wear-resistant. fire-retardant, compression, buffering, no damage to metal materials, etc features, Can fill the uneven surface, be tightly and firmly fit the heat source devices and heat sink. Has strong adhesive strength, effectively replace the grease and mechanical fixation,A large number of applications in the bonding heat sink to the microprocessor and other power consumption of the semiconductor. Applicable industry: 1. LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV. 2. communications industry, Industrial industry, household electrical appliance industry. Widely Applied: electronic products, motherboard, motor, external pad and foot pad, electronic, appliances,high power LED lighting,Car machine, power devices, automotive electronic modules (engine scrubber). Power Modules: high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation. Features: Thermal conductivity and high stability, its life than the general heat double-sided stickers long, normal temperature (30~+150 °C ) can work for a minimum of 5 years. Specification: Dimension: 20mm x 25m (Width x Length) Glass fiber thickness: 0.2mm Thermal Conductivity: 2W/m-k Breakdown Voltage: 5KVAC Thermal impedance : 0.3℃in2/w Initial Adhesion: 1.5kg/inch Package included: 1 Roll 25mx20mmx0.2mm Thermal Tape

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