Thermaltake
Thermaltake TG-30 Premium CPU/GPU Heatsink Thermal Compound | 4g | CL-O023-GROSGM-A
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- Item model number
- CL-O023-GROSGM-A
- Item Weight
- 0.317 ounces
- Package Dimensions
- 6.93 x 3.23 x 0.59 inches
- Manufacturer
- Thermaltake
Key features
- [Performance Compound] Contains diamond powder for higher heat transfer providing a thermal conductivity of 4.5 W/m-k.
- [All-In-One Application Kit] Includes tools to clean, prep, and install fresh thermal compound to your hardware.
- [Easy to Apply] Specially formulated to easily spread over the included honeycomb stencil for consistent compound application, providing a neat and well-covered CPU.
- [Sustainability and Safety] The TG-30 is a non-electrically conductive compound eliminating risk of short circuit and offers a longer lifespan minimizing dry-out or cracking
Specifications
| Brand | Thermaltake |
|---|---|
| Item model number | CL-O023-GROSGM-A |
| Item Weight | 0.317 ounces |
| Package Dimensions | 6.93 x 3.23 x 0.59 inches |
| Manufacturer | Thermaltake |
| Country of Origin | Taiwan |
| ASIN | B08HS1SXJH |
About this product
Designed to lower CPU temperatures effectively, TG-30 is a premium thermal compound which contains diamond powder to improve thermal conductivity to maximize heat transfer, providing a longer lifespan eliminating dry-out or cracking while in use. This thermal compound application kit includes a set of easily-applied tools for immediate use. On top of that, the TG-30’s honeycomb stencil can help users to apply thermal compound for a neat and well-covered surface which fits all CPUs.P/N: CL-O023-GROSGM-ATHERMAL CONDUCTIVITY: 4.5 W/m-kCOLOR: GrayWEIGHT: 4gVISCOSITY: 76 Pa-sTHERMAL IMPEDANCE: 0.185°C -in /WDENSITY: 2.55 g/cm
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